|
Home : Technology Overview : Foundry Services Foundry Services
State-of-the-Art Photonic Fab
Photonic Corp’s foundry provides development, prototyping, and low volume production services, including:
- Modeling and simulation services
- Device layout and photomask design
- Standard and custom photonic device library
We provide single or batch processing of 6” and 8” wafers, including SOI, silicon, glass, or quartz.
To find out more about Photonic Corp’s foundry capabilities and services, please email: sales@Photonic-Corp.com
Foundry Capabilities
| Lithography |
Deposition & Etch |
More Capabilities |
 |
 |
 |
Photolithography
Integrated photocluster set
- ASML Micrascan II+ high-resolution scanner
- 0.25um process can achieve 0.18um
photonic structure resolution
- Mated with RiteTrack/SVG resist deposition
- Two robotic 6” and 8” flows
|
PECVD deposition
- STS Mulitplex PECVD system: Oxide, nitride, oxynitride, TEOS
MRC metallization
Reactive metal oxide sputtering
- Silica, titania, tantala, Al2O3, etc.
Resist strip
RIE etch
- PlasmaTherm 770 ICP Etcher: Oxide,
nitride, oxynitride, Si, Al
RIE semiconductor etch
- SOI, silica, InP, InGaAs, InGaAsP
Wet etch chemistries
- For Si, SiO2, Au, Ti, Al, InP, GaAs
Optical AR and HR coating |
Wafer bonding
- EVG low-temperature, plasma-activated,
wafer-to-wafer bonding
- EVG wafer-to-wafer bonding aligner
MRL furnace annealing
Dicing, lapping, and polishing
Metrology and characterization
- Hitachi Scanning Electron Microscope
- Contact profilometry
- KLA/ Tencor stress measurement
- Leica optical microscopy
Packaging
- Die attach
- Wire bond
- Heat sink
- Fiber to device optical alignment and
pig-tailing
- Final test of packaged devices
|
|
